CATEGORIES![]() 3 Classic Op Amp Circuit AnalysesGuide to op amp circuits: using virtual short to analyze inverting,mpm solder paste printer noninverting, summing and balanced summing amplifiers with practical examples. ![]() Understanding AGND and DGND Grounding PracticesPractical grounding and decoupling guide for mixed-signal systems covering ground plane, AGND/DGND strategies, PCB layout, and ADC/DAC clock and return-path issues. ![]() ESD Implementation Strategies for Amplifier InputsGuide to internal ESD diodes and overvoltage protection for amplifier inputs, covering diode topologies, current limiting, thermal effects, and electromigration. ![]() Crystal Oscillator Operation and Load Capacitor SelectionPractical engineering guide to Pierce oscillator design: crystal equivalent model, load capacitance tuning, startup/gain margin checks, drive-level and PCB layout recommendations. ![]() How to Choose Inductors: Common ParametersTechnical guide to inductors and inductance: covers permeability, resistance, core loss, saturation, self-resonant frequency, ripple and selection for DC/DC converters. ![]() MOSFET Gate Driver Circuit DesignOverview of MOSFET gate drive principles, gate-to-source capacitance and gate charge, threshold behavior, and gate charge calculation for driver circuit design. China SiC Substrate Prices Fall in 2024; 800V Adoption NearsAnalysis of China SiC substrate price decline in 2024: domestic prices plunged vs global quotes, driven by capacity expansion, competition and potential price war. ![]() Common Diode Uses in LDO CircuitsSummary of common diode applications in LDO circuits: reverse-connection protection, GND isolation, input-output clamping, and output drop/backfeed prevention. ![]() Handling Unused Op Amp or Comparator PinsGuidance on terminating unused op amp sections and comparators to avoid floating inputs: use voltage followers to set inputs to ground or VCC/2. Silicon Carbide Power Devices: Properties and PrinciplesReview of silicon carbide (SiC) power devices covering principles, key characteristics, applications and challenges for high-efficiency power electronics and energy conversion. ![]() Efficient Interconnects for SiC Power DevicesAnalysis of silver sintering and copper wire bonding for SiC power devices, comparing sintering methods, substrate surface effects and thermal-shock impact on reliability. ![]() Understanding MOSFET ParametersMOSFET technical summary of electrical and thermal specs: key ratings (VDSS, VGS, ID), thermal resistance RθJA and Tj calculation, capacitances, gate charge and switching timings. ![]() IGBT Switching Process and Driver Design FactorsTechnical analysis of IGBT switching with diode?clamped inductive load: interval-by-interval turn-on/turn-off waveforms, diode recovery, tail current, and driver requirements. ![]() Why Paralleling Schottky Diodes Is Not RecommendedOverview of Schottky diode characteristics and usage notes, including forward voltage, reverse leakage behavior, and why paralleling identical diodes risks unequal current sharing. ![]() What Is Diode Clamping? Applications of Clamping ProtectionOverview of diode clamp and clamping circuit operation, positive/negative and bias clamps, RC time-constant design, component selection, and protection applications. ![]() Derating Guidelines for Power Supply ComponentsPractical derating guidelines for power-supply components: rules, accelerated-test models, and component-specific limits (ICs, capacitors, MOSFETs, resistors) for reliability. Crystal Growth Methods for Lowering SiC Substrate CostsTechnical overview of silicon carbide substrate production comparing PVT, liquid-phase and HTCVD crystal growth methods, challenges and advances in scaling low-defect wafers. ![]() Nine Essential Circuit Modules for Hardware EngineersSummarizes nine standard circuit design modules - power module, IO, op amp decoupling, high-speed termination, ground return, test points - to improve PCB design reliability. ![]() Hidden Pitfalls of Inverting Input AmplifiersExplains how an inverting amplifier's low input impedance (equal to Rin) and source internal resistance reduce closed-loop gain, causing gain error and instability. ![]() MOSFET Gate Circuits and PNP Turn-off DriverTechnical overview of MOSFET gate functions and drive implementations, including direct drive, external drivers, speed?up diode, PNP turn?off, floating and isolated drives. |

















